NOVELTY - An adhesive composition is a mixed composition comprising 50-1000 parts mass thermally-conductive filler (B) and 30-700 parts mass thermally-conductive filler (C) with respect to 100 parts mass (meth)acrylic resin composition (A) containing (meth)acrylic ester polymer (A1) and (meth)acrylic ester monomer (A2). A polymerization reaction of monomer (A2) is performed in the mixed composition. The filler (C) is surface treated using a silane coupling agent. The total content of filler (B) and filler (C) in the mixed composition is 250-1300 parts mass.    USE - Adhesive composition is used in manufacture of sheet-like molded article used for electronic device (all claimed). Uses include but are not limited to television, mobile telephone, automatic vending machine, refrigerator, solar cell, game machine, notebook personal computer, washing machine, rice cooker, fuel cell, etc.    ADVANTAGE - The pressure-sensitive adhesive composition has excellent thermal conductivity due to the presence of filler in an increased amount, and provides sheet-like molded article with excellent tensile strength.    DETAILED DESCRIPTION - An adhesive composition is a mixed composition comprising 50-1000 parts mass thermally-conductive filler (B) and 30-700 parts mass thermally-conductive filler (C) with respect to 100 parts mass (meth)acrylic resin composition (A) containing (meth)acrylic ester polymer (A1) and (meth)acrylic ester monomer (A2). A polymerization reaction of monomer (A2) is performed in the mixed composition. The filler (C) is surface treated using a silane coupling agent and the filler (B) is not subjected to a surface treatment using the silane coupling agent. The total content of filler (B) and filler (C) in the mixed composition is 250-1300 parts mass. INDEPENDENT CLAIMS are included for the following:    (1) sheet-like molded article (4,14), which is obtained by molding the mixed composition in a sheet form;    (2) manufacture of adhesive composition, which involves mixing (meth)acrylic resin composition (A), filler (B), and filler (C), and polymerizing monomer (A2);    (3) manufacture of sheet-like molded article; and    (4) electronic device, which consists of a heat-generating material and the sheet-like molded article bonded using the adhesive composition.    DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of sheet-like molded article.    Substrate (1)    Electronic component (2)    Heat sink (3,13)    Sheet-like molded article (4,14)    Transistor (12a)