NOVELTY - A heat-conductive pressure-sensitive adhesive composition contains 100 parts mass (meth)acrylic resin composition comprising (meth)acrylate polymer and (meth)acrylate monomer, 200-1500 parts mass thermally-conductive filler, 0.5-30 parts mass tackifier, and 1-30 parts mass dispersant. The dispersant comprises fatty acid ester of polyhydric alcohol polymer. The heat-conductive pressure-sensitive adhesive composition is obtained by polymerization reaction.    USE - Heat-conductive pressure-sensitive adhesive composition is used for manufacturing sheet-like molded product for electronic device (all claimed). Uses include but are not limited to plasma display panel, integrated-circuit chip, fuel cell, solar cell, mobile telephone, portable information terminal, notebook personal computer, liquid crystal panel, and surface-conduction electron-emitter display.    ADVANTAGE - The sheet-like molded product formed using the heat-conductive pressure-sensitive adhesive composition has excellent external appearance and flexibility.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) heat-conductive pressure-sensitive-adhesive sheet-like molded product (4,14,24), which is obtained by molding heat-conductive pressure-sensitive adhesive composition;    (2) manufacture of heat-conductive pressure-sensitive adhesive composition, which involves polymerizing (meth)acrylic resin composition comprising (meth)acrylate polymer and (meth)acrylate monomer, thermally-conductive filler, tackifier, and dispersant;    (3) manufacture of heat-conductive pressure-sensitive-adhesive sheet-like molded product; and    (4) electronic device, which has heat-conductive pressure-sensitive-adhesive sheet-like molded product and heat-generating component (2,12a,12b,22), or heat-generating component which is bonded by heat-conductive pressure-sensitive adhesive composition.    DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of the heat-conductive pressure-sensitive-adhesive sheet-like molded product.    Substrate (1)    Heat-generating components (2,12a,12b,22)    Thermal radiation components (3,13)    Heat-conductive pressure-sensitive-adhesive sheet-like molded products (4,14,24)