NOVELTY - A silicone resin layer-laminated supporting base material (12) and electronic device (22) are separated from electronic device material-containing laminate. The silicone resin layer-laminated supporting base material and electronic device are separated from each other by supplying an organic solvent having a solubility parameter of more than 10, or a mixed solution of organic solvent and water to a peeling line, i.e., a boundary line, on the peeling interface between the silicone resin layer (14) and the glass substrate (16) to obtain electronic device.    USE - Manufacture of electronic device e.g. liquid crystal display panel, organic electroluminescent panel, and field emission panel for display apparatus, and solar cell.    ADVANTAGE - The method provides electronic device with excellent peeling property with respect to silicone resin layer and glass substrate, even after high-temperature heat-processing.    DETAILED DESCRIPTION - A silicone resin layer-laminated supporting base material and electronic device are separated from an electronic device material-containing laminate. An interface between a silicone resin layer and a glass substrate is made into a peeling surface from electronic device material-containing laminate having a supporting base material, a silicone resin layer, a glass substrate, and an electronic device material-containing laminate in order. The silicone resin layer-laminated supporting base material and electronic device are separated from each other by supplying an organic solvent having a solubility parameter of more than 10, or a mixed solution of organic solvent and water to a peeling line, i.e., a boundary line, on the peeling interface between the silicone resin layer and the glass substrate to obtain electronic device.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of electronic device.    Supporting base material (12)    Silicone resin layer (14)    Glass substrate (16)    Electronic device material (18)    Electronic device (22)