NOVELTY - The heat sink module (100) has a dividing element that is arranged between an inlet chamber and an outlet chamber. The dividing element is provided with multiple orifices that extend from a top surface to a bottom surface of the dividing member. The orifices are provided to deliver multiple jet streams of coolant into the outlet chamber and against a heat providing surface, when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.    USE - Heat sink module of cooling apparatus for electrical device such as densely packed server in data center, medical imaging device, solar panel, high-power diode laser array, and electric vehicle component e.g. battery pack, electric motor, and power electronics, mechanical device such as turbine, internal combustion engine, turbocharger, after-treatment components, braking system, engine intake manifold, plasma cutter, drill, oil and gas exploratory and recovery equipment, water jet cutter, welding system, and computer numerical control (CNC) mills or lathe, and chemical equipment e.g. rotary evaporator and reflux distillation condenser.    ADVANTAGE - The size, energy-consumption and operating cost of the heat sink module are reduced. The risk of overheating of critical components in the electronic/electrical device is reduced, while maintaining or improving the electronic/electrical device performance. The heat transfer rate of the heat sink module is improved. The thermal resistances associated with thermal interface materials are eliminated, while enhancing performance and overall efficiency of the heat sink module. The height of the heat sink module is reduced. The structural integrity of the heat sink module is improved. The length of the three-phase contact line on to-be-cooled surface is increased, while allowing higher heat fluxes to be effectively dissipated without reaching critical heat flux.    DESCRIPTION OF DRAWING(S) - The drawing shows a top perspective view of the server with cooling apparatus.    Cooling apparatus (1)    Heat sink module (100)    Inlet port (105)    Outlet port (110)    Server (400)