TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The one or more adhesion layers contain chromium, titanium and/or nickel. Preferred Process: The conductive film method further involves associating (12,14) the insulating substrate with one or more adhesion layers conductive layers. The associating step is performed by a method chosen from sputtering method, spraying method, electrodeposition method, printing method, electron beam evaporation method, thermal evaporation method and atomic layer deposition method, preferably electrochemical deposition method. The method further involves cleaning (10) the insulating substrate. The method further involves incorporating (22) the conductive film into an electronic device, associating the conductive film with a solid electrolyte, associating (24) solid electrolyte with conductive film (c2), separating the inorganic layer from the conductive film and forming (28) free-standing inorganic layer. Preferred Components: The inorganic layer is of formula: MXn. The one or more conductive layers are chosen from gold, aluminum, copper, platinum and silver. The inorganic composition is chosen from metal, transition metal, metal oxide, transition metal oxide, metal chalcogenide, metal halide and alloy. The inorganic layer comprises nickel fluoride.M=metal chosen from iron, nickel, cobalt, platinum, gold, aluminum, chromium, copper, manganese, magnesium, molybdenum, rhodium, silicon, tantalum, titanium, tungsten, uranium, vanadium, zirconium, and alloy, transition metal or alloy;X=fluoro, chloro and bromo, oxide or chalcogenide;andn=1-6.Preferred Properties: The inorganic layer comprises has pore diameter of 1-50 nm, thickness of 500 nm to 1 mu m, capacitance of 0.1-1000 mF/cm2, energy density of 0.1-500 Wh/kg, power density of 1-50 kW/kg. The formed conductive film has thickness of 100-200 mu m. The electronic device has an energy density of 10-500 Wh/kg, capacitance of 1-1000 mF/cm2, capacitance of 1-1000 mF/cm2.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The insulating substrate comprises an insulating polymer. The insulating polymer comprises poly(ethylene terephthalate).