NOVELTY - Manufacture of product involves providing a substrate (1) having an exposed receiving surface (2), contacting an electrolyte with receiving surface, depositing a nanostructure deposit (20) comprising nanostructures (21) of zinc oxide and/or zinc hydroxide from the electrolyte on the receiving surface of substrate, completing deposition of nanostructure deposit, applying a layer (30) of material (A) on the nanostructure deposit, and penetrating material (A) into interstices (25) formed between nanostructure deposit. The packing density of nanostructure deposit is 10-70%.    USE - Manufacture of product e.g. metal component used for electrical component e.g. printed circuit board (all claimed) used for solar cell, and light-emitting diode.    ADVANTAGE - The method enables manufacture of product with excellent adhesiveness, durability, corrosion resistance, and heat resistance, by fast process.    DETAILED DESCRIPTION - Manufacture of product involves providing a substrate having an exposed receiving surface, arranging the substrate in a bath comprising an electrolyte containing zinc ions and hydroxide ions, contacting the electrolyte with the exposed receiving surface, depositing a nanostructure deposit comprising nanostructures of zinc oxide and/or zinc hydroxide from the electrolyte on the receiving surface of substrate arranged in the electrolyte, completing deposition of nanostructure deposit before filling interstices with zinc oxide and/or zinc hydroxide nanostructures, applying a layer of material (A) on the nanostructure deposit, and penetrating the material (A) into the interstices formed between the zinc oxide and/or zinc hydroxide nanostructure deposit. The nanostructures have a primary end, a secondary end located opposite to the primary end, and a base provided in the primary end attached to the receiving surface and a tip at a distance from the receiving surface having secondary end. The nanostructures extend in a direction perpendicular to the receiving surface, and form zinc oxide and/or zinc hydroxide nanostructure deposit with interstices provided between the nanostructures. The interstices extend to the outer surface of the nanostructure deposit away from the receiving surface. The packing density of nanostructure deposit is 10-70%. INDEPENDENT CLAIMS are included for the following:    (1) metal component;    (2) electrical component; and    (3) printed circuit board.    DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of substrate containing the nanostructure deposit and the layer of material.    Substrate (1)    Receiving surface (2)    Nanostructure deposit (20)    Nanostructure (21)    Interstices (25)    Layer (30)