TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The copper compound is chosen from copper nitrate, copper sulfate, copper sulfite, copper acetate, copper chloride, copper bromide, copper iodide, copper phosphate, and copper carbonate. The complex solution used during the manufacturing process contains ammonia solution and silver nitrate solution. The total concentration of ammonia and silver nitrate in the complex solution is 0.006-0.06 M. The concentration of ammonia in the complex solution is 0.01-0.3 M. The content of silver in the silver-coated copper nanowires is 2-60 pts. wt. with respect to 100 pts. wt. nanowires.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The concentration of sodium hydroxide, copper compound, and piperazine or hexamethylenediamine in the silver-coated copper nanowires is 2.5-25 M, 0.004-0.5 M, and 0.008-2 M, respectively. The reducing agent is chosen from hydrazine, ascorbic acid, L(+)-ascorbic acid, isoascorbic acid, ascorbic acid derivative, oxalic acid, formic acid, phosphoric acid, and sodium borohydride. The concentration of reducing agent in the silver-coated copper nanowires is 0.01-1 M. The silver-coated copper nanowires further contain capping agent chosen from piperazine, hexamethylene diamine, ethylene diamine, triethylene diamine, propane-1,3-diamine, butane-1,4-diamine, pentane-1,5-diamine, N,N,N',N'-tetramethylethylenediamine, N,N-diethyl ethylene diamine, N,N,N'-trimethyl-1,3-propanediamine, N,N-dimethyl ethylene ethyl-N'-diamine, N-propyl-1,3-propanediamine, N2,N2-dimethyl-1,2-butanediamine, N-butyl ethylene diamine, N-isopropyl-1,3-propane diamine, polyethylene glycol diamine, 1,3-cyclohexane diamine, N-methyl-N'-cyclopropyl-ethylenediamine, N,N'-dimethyl ethylenediamine, N-ethyl ethylenediamine, N-methyl ethylene diamine, N,N'-dimethylhexene-1,6-diamine, N,N,N',N'-tetramethyl-1,4-butanediamine, and N-methyl-N'-cyclohexyl ethylene diamine. The concentration of capping agent in the silver-coated copper nanowires is 0.01-1 M.