NOVELTY - The method involves providing a carrier, and applying an interface layer to the carrier. A set of semiconductor dies (124) is provided. Each semiconductor die is mounted to the carrier and the interface layer by pressing the semiconductor die to the interface layer for a second and simultaneously thermal compression bonding multiple semiconductor die to the interface layer for about 5 to 10 seconds, where the interface layer includes non-conductive paste or a non-conductive film. An encapsulant (152) is deposited over the semiconductor die.    USE - Method for making a semiconductor device used in an electronic device e.g. cellular phone, personal digital assistant and digital video camera, to perform various functions in various fields. Uses include but are not limited to microcontroller, microprocessor, charged-coupled device, solar cell and digital micro-mirror device used in electronic device to perform signal processing, high-speed calculation, transmitting and receiving electromagnetic signal, controlling electronic device, transforming sunlight to electricity and creating visual projections for TV display in entertainment, communication, power conversion, network, computer, consumer product, military application, aviation, automotive, industrial controller and office equipment.    ADVANTAGE - The method enables utilizing the flipchip semiconductor device that provides a short electrical conduction path from active devices on the die to conduction tracks on a printed circuit board such that signal propagation distance and capacitance is reduced, thus improving overall circuit performance. The method enables mounting the die to the carrier and the interface layer by pressing the die to the interface layer for 1 second, and simultaneously thermal compression bonding multiple die to the interface layer for about 5 to 10 seconds, so that overall throughput of die bonding is increased, thus achieving better joint reliability, and minimizing or eliminating die shifting.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a semiconductor device.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view illustrating two-step individual die bonding for short time and multiple die thermal compression bonding to a carrier for longer time.    Semiconductor die (124)    Back surface of semiconductor die (128)    Active surface of semiconductor die (130)    Encapsulant (152)    Build-up interconnect structure (154)