NOVELTY - A silicone cured film is formed on single side of front surface and back surface of hard panel, and arranged such that photovoltaic cell string is inserted between silicone cured film surfaces of front surface and back surface of hard panel, to form laminate. The laminate is placed in vacuum space, pressed, heated, and photovoltaic cell string is sealed, to obtain solar cell module in which several photovoltaic cell strings are sealed by silicone cured film between front surface and back surface of hard panel.    USE - Manufacture of silicone-sealed solar cell module (claimed).    ADVANTAGE - The method enables manufacture of reliable silicone-sealed solar cell module having excellent thermal shock resistance.    DETAILED DESCRIPTION - A silicone cured film is formed on single side of front surface and back surface of hard panel, and arranged such that photovoltaic cell string is inserted between silicone cured film surfaces of front surface and back surface of hard panel, to form laminate. The laminate is placed in vacuum space, pressed, heated, and photovoltaic cell string is sealed, to obtain solar cell module in which several photovoltaic cell strings are sealed by silicone cured film between front surface and back surface of hard panel. The silicone cured film includes cured film (X) formed using organopolysiloxane composition (I) containing organopolysiloxane (A-1) having viscosity at 23 degrees C of 100-100000 mPa.second and containing 1 or more aliphatic unsaturated groups coupled with silicon atom in a molecule, organic compound (A-2) containing 1 or more aliphatic unsaturated groups which are capable of hydrosilylation reaction with respect to hydrogen atom coupled with silicon atom in one molecule, organohydrogenpolysiloxane (B) containing 2 or more of hydrogen atoms coupled with silicon atom in a molecule, and hydrosilylation reaction catalyst (C) which is platinum-based catalyst, and cured film (Y) formed using organopolysiloxane composition (II) containing organopolysiloxane (D-1) having viscosity at 23 degrees C of 100-100000 mPa.second and containing 1 or more aliphatic unsaturated groups coupled with silicon atom in one molecule, organic compound (D-2) containing 1 or more aliphatic unsaturated groups which are capable of hydrosilylation reaction with respect to hydrogen atom coupled with silicon atom in a molecule, and organohydrogenpolysiloxane (E) containing 2 or more hydrogen atoms coupled with silicon atom in a molecule, and hydrosilylation reaction catalyst (F) which is platinum-based catalyst. The amount of organopolysiloxane (A-1) and organic compound (A-2) based on 100 parts mass total of organopolysiloxane (A-1) and organic compound (A-2) is 80-100 parts mass and 0-20 parts mass, respectively. The ratio (p) of number of moles (b) of hydrogen atom coupled with silicon atom contained in the organopolysiloxane (A-1), with respect to number of moles (a) of aliphatic unsaturated group in organic compound (A-2) is 0.25-1.3 (excluding 1.3). The ratio (q) of number of moles (e) of hydrogen atom coupled with silicon atom contained in the organopolysiloxane (D-1), with respect to number of moles (d) of aliphatic unsaturated group in organic compound (D-2) is 0.3-10 (excluding 0.3). The amount of organopolysiloxane (D-1) and organic compound (D-2) based on 100 parts mass total amount of organopolysiloxane (D-1) and organic compound (D-2) is 80-100 parts mass and 0-20 parts mass, respectively. The difference of modulus between ratios (p) and (q) is more than 0.7. The ratio of ratios (q) and (p) is 1.3 or more.