TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The inorganic compound is fluorescent substance and/or metal oxide.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The article has a coating film shape or a sheet form. The thermosetting resin composition further contains a hardening inhibitor (C), a thermosetting resin (D) obtained by reacting silsesquioxane containing silicon hydride group, organopolysiloxane containing two alkenyl groups, epoxy compound containing alkenyl group, and silyl compound containing silicon hydride group and alkenyl group, an organopolysiloxane compound (E) containing 2 or more alkenyl groups, a linear organopolysiloxane compound (F) containing silicon hydride group in mono-terminal, and an inorganic compound dispersed in the composition. The content of component (C) in the thermosetting resin composition is 250-200000 times with respect to the mass of catalyst (B). The silsesquioxane is double decker-type silsesquioxane. The resin (A) is of formula (I). The resin (D) is of formula (G), preferably of formula (III). The compound (F) is of formula: R6-(-Si(-R7)(-R7)-O-)m-Si(-R7)(-R7)-H (IV). The compound (E) is of formula: H2C=C-Si(-R8)(-R8)-(-O-Si(-R9)(-R9)-)n-O-Si(-R8)(-R8)-C=CH2 (V). The content of silicon hydride group in the resin (D) is 1-50 %mass. The content of compound (E) and compound (F) in the thermosetting resin composition is 1-10 %mass and 2-20 %mass, respectively, with respect to total mass of the thermosetting resin composition.X=-H or group of formula (ii) or (iii);a+2b+c=4;a=less than 3;b=0-1;c=0-3;R1,R6,R7=1-4C alkyl, cyclopentyl, or cyclohexyl;m=1-100;R2,R3,R'3,R"=1-4C alkyl, cyclopentyl, cyclohexyl, or phenyl;r=2-20;R4,R5,R7,R8=1-4C alkyl, cyclopentyl, cyclohexyl, or phenyl;s=2-20;X'=-H, or group chosen from groups of formulae (iv)-(x);m',r=1-100;t,x,m=1-20;R4,R'4,R"4=methyl, ethyl, butyl, or isopropyl;y=1-10;aii=0.1-3.5;yii=0-3;zii=0.1-3.5;2xii=0-2;n=1-50;R'1=CH3;andR'2=H or CH3.(i) The number (A) of H contained in the resin (D) is 0.5-3; (ii) the number (C) of group (v), group (vi), or group (vii) in the resin (D) is 0.1-2; (iii) the number (D) of group (viii), group (ix), or group (x) in the resin (D) is 0-1; (iv) The number (A) of H, number (B) of group (iv), number (C) of group (v), group (vi), or group (vii), and number (D) of group (viii), group (ix), or group (x) in the resin (D) satisfies the relation: A+2B+C+D=4; (v) the number (B) of group (iv) satisfies the relation: 0.5 less than or equal to 2B less than or equal to 2. Preferred Process: The silsesquioxane is obtained by reacting organopolysiloxane containing alkenyl groups and epoxy compound containing alkenyl groups. Preferred Properties: The thermosetting resin composition has a viscosity increasing rate of less than 50%, when maintained under storage conditions at 80 degrees C for 30 days. The article has a thickness of 0.1-3000 mu m.