NOVELTY - An electrically conductive ink, comprises aromatic resins; electrically conductive silver particles having an average particle size of 1-40 mu m, and a tap density of 1.5-6.5 g/cm3; and organic solvents.    USE - The electrically conductive ink is used in a bonded assembly or a solar module, and used for forming an electrically conductive pathway on a substrate which comprises or essentially consists of aluminum, and for fabricating electronic devices (all claimed).    ADVANTAGE - The electrically conductive ink has an excellent adhesion to aluminum or aluminum-containing substrates. After having been dried, the electrically conductive ink can be soldered directly to further metallic substrates, where a stable and reliable electrical interconnection is formed which exhibits a good bonding strength.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are:    (1) a dried product of the electrically conductive ink above;    (2) a bonded assembly, comprising a first substrate and a second substrate which are electrically connected, where the first substrate exhibits electrically conductive pathways on its surface, which are formed by the dried product of (1) and the electrically conductive pathways are attached to the second substrate by a soldering material thus forming an electrically conductive connection between the first and the second substrate;    (3) a solar module, comprising the bonded assembly of (1);    (4) a method of forming an electrically conductive pathway on a substrate by (a) providing the electrically conductive ink above, (b) applying the electrically conductive ink to one part of a substrate, and (c) exposing the substrate to 70-300 degrees C to form an electrically conductive pathway on one part of the substrate; and    (5) a method of forming a bonded assembly by (a) providing the electrically conductive ink above, (b) applying the electrically conductive ink to one part of a first metallic substrate, (c) exposing the first metallic substrate to 70-300 degrees C to form an electrically conductive pathway on one part of the first substrate, (d) soldering a second metallic substrate to the electrically conductive pathway to thus forming an electrically conductive connection between the first and the second substrate.