TECHNOLOGY FOCUS - ELECTRONICS - Preferred Arrangement: The organic electronic device has substrate, transparent electrode layer provided on substrate, organic layer including 1 or more light-emitting layers provided on transparent electrode layer, and reflecting electrode layer provided on organic layer. The hygroscopic film is provided in the reflecting electrode layer.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The hygroscopic particles (A) and (B) are chosen from calcium oxide, magnesium oxide, calcium chloride, calcium carbonate, calcium zirconate, calcium titanate, silicon dioxide, calcium silicate, magnesium chloride, phosphorus pentoxide, lithium oxide, sodium oxide, barium oxide, lithium sulfate, sodium sulfate, calcium sulfate, magnesium sulfate, cobalt sulfate, gallium sulfate, titanium sulfate, nickel sulfate, strontium chloride, yttrium chloride, copper chloride, cesium fluoride, tantalum fluoride, lithium bromide, tantalum fluoride, calcium bromide, cerium bromide, selenium bromide, vanadium bromide, magnesium bromide, barium iodide, magnesium iodide, barium perchlorate, and magnesium perchlorate. The content of hygroscopic particles (B) is 5-20 pts. wt. with respect to 100 pts. wt. of hygroscopic particles (A). Preferred Properties: The getter material has moisture content of 0-0.1 wt.% at 25 degrees C, and relative humidity of 70%. The hygroscopic particles (A) have moisture content of 0.1 wt.% at 25 degrees C, after maintained at relative humidity of 70%. The hygroscopic particles (B) have moisture content of 0-0.1 wt.% at 25 degrees C, after maintained at relative humidity of 70%. The average particle diameter of hygroscopic particles (A) is 10-90 nm. The average particle diameter of hygroscopic particles (B) is 5-20 nm. The hygroscopic film has optical transmittance rate of more than 88%, and haze of less than 3%.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The getter layer further comprises base resin, and binder resin. The base resin is chosen from acrylic resin, polyester resin, isocyanate resin and epoxy resin. The content of binder resin is 50-200 pts. wt. with respect to 100 pts. wt. of base resin. The binder resin is chosen from phenoxy resin, acrylate resin and high-molecular weight epoxy resin.