TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The surfactant is hexadecyl trimethyl ammonium bromide, octadecyl trimethyl ammonium chloride, sodium dodecyl benzene sulfonate, hexadecyl sodium sulfonate, potassium stearate, oleoyl base polycondensate amino acid sodium salt, sodium lauryl aminopropionate, sodium lauryl sulfate, polyepoxy ethylene lauroyl ether, sorbitan monolaurate, oleic diethanolamide, dodecyl dimethyl betaine, tetradecyl dimethyl sulfoethyl betaine, stearic acid, oleamide, oleic acid, or alkyl polyethenoxy ether compound; the molar concentration of surfactant in hydrophobic solvent is 0.01-10000 mmol/l. The hydrophobic solvent is toluene, xylene, n-hexane, cyclohexane, cyclohexanone, carbon tetrachloride, chloroform, methyl isobutyl ketone, or isopropyl acetate. The metal precursor aqueous solution mol concentration is 0.1-5000 mmol/l; the metal precursor is molybdenum compound, ruthenium compound, rhodium compound, palladium compound, silver compound, rhenium compound, osmium compound, iridium compound, gold compound, iron compound, cobalt compound, nickel compound, or copper compound. Molybdenum compound is molybdenum chloride, molybdenum thionyl chloride, chloro molybdate, or chloromethylene molybdate. Ruthenium compound is ruthenium trichloride, ruthenium chloride, or chloro ruthenium salt. Rhodium compound is rhodium trichloride, rhodium sulfate, rhodium chloride, rhodium sulfate, rodium chloride acid, or rhodium chloride salt. Palladium compound is palladium dichloride, palladium tetrachloro salts, or palladium sulfate. Silver compound is silver nitrate. Rhenium compound is rhenium pentachloride, perrhenic acid, or perrhenate. Osmium compound is osmium tetrachloride, chloro osmium tetroxide or chloro osmate. Iridium compound is iridium tetrachloride, chloro iridium acid, or chloro iridium salt. Gold compound is gold trichloride, chloroauric acid, or chloroaurate. Iron compound is ferric trichloride, ferrous dichloride, ferric sulfate, ferrous sulfate, ferric nitrate, or ferrous nitrate. Cobalt compound is cobalt dichloride, cobalt trichloride, cobalt nitrate, or cobalt sulfate. Nickel compound is nickel chloride, nickel sulfate, or nickel nitrate. Copper compound is copper chloride, cuprous chloride, copper sulfate, cuprous sulfate, copper nitrate, or cuprous nitrate. The reducing agent is formaldehyde, formic acid, lithium borohydride, sodium borohydride, potassium borohydride, methyl alcohol, ethyl alcohol, polyhydric alcohols, hydrated hydrazine, oxalic acid, malic acid, citric acid, glucose, sucrose, or ascorbic acid. The mol concentration of reducing agent and reaction system is 0.5-5000 mmol/l. Alkaline solution is aqueous ammonia, ethylene diamine, n-butylamine, sodium hydroxide, potassium hydroxide, lithium hydroxide, tetraethyl ammonium hydroxide, or tetrapropyl ammonium hydroxide. Orthosilicate ester compound is methyl orthosilicate, ethyl orthosilicate, propyl orthosilicate, or butyl silicate. The catalyst appearance is nano-wire network construction, metal line network with diameter of 30 nm, diameter size distribution is 5-20%, length is 5-500 nm, silicon dioxide hole thickness of outside layer is 0.1-15 nm.