TECHNOLOGY FOCUS - POLYMERS - Preferred Process: In processing the perfluoropolymer material, the perfluoroelastomeric material comprises one or more selected from tetrafluoroethylene (TFE), hexafluoropropylene (HFP), and perfluoroalkylvinyl ethers (PAVEs), or a perfluoroalkoxyvinyl ether. The perfluoroalkylvinyl ethers contain alkyl groups that are either straight or branched, and which and include one or more ether linkages selected from perfluoro (methyl vinyl ether), perfluoro (ethyl vinyl ether), perfluoro (propyl vinyl ether). The perfluoroelastomeric material comprises a terpolymer of tetrafluoroethylene, a perfluoroalkylvinyl ether, and at least one perfluorinated cure site monomer which incorporates a functional group to permit crosslinking of the terpolymer. The curesite monomer comprises a cyano, a bromo, iodo or pentafluorophenoxy functional group. The porogens comprise one or more materials selected from sodium chloride, salicylic acid, lactose, valine, sodium bicarbonate, sodium hydrogen carbonate, calcium carbonate, glycine, polyethylene oxide, polyethylene glycol (PEG), polyvinylpyrrolidone, particulate polymers, polyvinyl chloride, and/or titanium dioxide. The porogen is present in an amount of 10-500 pts. wt., based on weight of the perfluoropolymer in the perfluoroelastomeric material. The process further involves removing the porogen from the cured perfluoroelastomeric material. The functional additive comprises one or more selected from co-agents, processing aids, fillers, acid acceptors, cure accelerators, glass fibers, polyaramid fibers, curatives and/or plasticizers. The substrate is a metallic mandrel, a non-metallic mandrel, a metallic implant, or a non-metallic implant. Moreover, a set of layers are deposited on the substrate. The resultant mixture from steps (i) and (ii) is applied to the substrate in step (iii) using a method selected from: Pneumatic spraying, Electrostatically focused pneumatic spraying, Electro spraying, Ultrasonic spraying, Syringing, Electrostatic spinning, Inkjet printing, Dip coating, and Brushed/painted. In step (iv), the substrate is heated using directional heating, and only one solvent is used. The solvent is substantially completely removed.