NOVELTY - Producing electrode plate (1), comprises providing ions by means of the ion plasma activation of steam of the relevant layer, and bombarding ions on the carrier plate. The electrode plate comprises a metallic carrier plate (2) and at least one side having a conductive surface contact layer (4) by means of physical vapor deposition (PVD) in a vacuum coating system, a metal-based base layer (5), and carbon contact layer(6) arranged superposed on top of the surface contact layer, base layer and/or carbon contact layer by electron beam vacuum deposition.    USE - The method is useful for producing electrode plate (claimed).    ADVANTAGE - The method produce electrode plates having same electrical and corrosion properties.    DETAILED DESCRIPTION - Producing electrode plate (1), comprises providing ions by means of the ion plasma activation of steam of the relevant layer, and bombarding ions on the carrier plate. The electrode plate comprises a metallic carrier plate (2) and at least one side having a conductive surface contact layer (4) by means of physical vapor deposition (PVD) in a vacuum coating system, a metal-based base layer (5), and carbon contact layer(6) arranged superposed on top of the surface contact layer, base layer and/or carbon contact layer by electron beam vacuum deposition. An INDEPENDENT CLAIM is also included for device for producing electrode plate comprising a vacuum chamber having at least two coating units for generating a coating source of deposited coating material, and a substrate holder for arranging a support plate opposite to each coating source for depositing the respective coating material in a coating zone. The coating unit is provided with at least one electron beam evaporator and an ionization unit arranged such that vaporous coating material is ionized or at least one portion of the coating source associated with coating area is bombarded with ions.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the electrode plate.    Electrode plate (1)    Metallic carrier plate (2)    Surface contact layer (4)    Base layer (5)    Carbon contact layer (6)