NOVELTY - The apparatus (1) has a polymeric supply unit (3) that is adhered to a substrate (9) and contaminant and configured to supply polymer with polarity. The polymer is an ionic surfactant having 10,000 or less molecular weight and 1,200 or less molecular weight. The ionic surfactant consists of polyethylenimine (PEI) type, urethane type, polycarboxylic acid system, acrylic resin type, thiol system, or silane system. A physical cleaning unit (4) is configured to perform a non-contact physical cleaning with respect to the substrate to which the polymer is adhered.    USE - Substrate cleaning apparatus for removing contaminant adhering to substrate e.g. glass substrate for LCD devices, plasma display panel (PDP), photomasks, color filters, recording disks, and solar cells, for use in manufacture of semiconductor wafer.    ADVANTAGE - The contaminant is efficiently removed, restraining a physical damage, when the surface of the substrate is physically cleaned in a state, since the surface of the substrate and contaminant electrically charged in negative, respectively, is mutually repelled by an electrostatic repulsion.    DETAILED DESCRIPTION - The substrate to which the polymer adhered, and the contaminant to which the polymer adhered comprise a repulsive force in a pure water or aqueous solution. The physical cleaning unit has two fluid nozzles which injects the atomized cleaning liquid on the surface of the substrate, and a nozzle moving mechanism (48) scans the two fluid nozzles along the surface of the substrate. A cleaning-liquid supply nozzle (41) supplies a cleaning liquid to the surface of the substrate. An ultrasonic wave generation unit adds an ultrasonic vibration to the cleaning liquid supplied to the surface of the substrate. A detachment unit is an UV ozone cleaning unit, which disconnects the polymer from the substrate. A supernatent-liquor supply unit (5) supplies a supernatent liquor which is a solution which dissolved ozone. A heating mechanism heats the surface of the substrate at 400 degrees C or more. A pressure reduction mechanism pressure-reduces the inside of a chamber (8) which accommodates the substrate in an inside. An INDEPENDENT CLAIM is included for a substrate cleaning method for removing the contaminant adhering to the substrate involves supplying the ionic surfactant which is a cation form surfactant which a hydrophilic group positively charges in aqueous solution. The neutral polymeric aqueous solution is supplied to the substrate to perform the non-contact physical cleaning by making acidic aqueous solution contact the substrate surface. The ionic surfactant which is anionic form surfactant which a hydrophilic group negatively charges in aqueous solution is supplied. The acidic polymeric aqueous solution is supplied to the substrate to perform non-contact physical cleaning in by making neutral aqueous solution or pure water contact the substrate surface.    DESCRIPTION OF DRAWING(S) - The drawing shows a longitudinal cross-sectional view of the substrate cleaning apparatus. (Drawing includes non-English language text)    Substrate cleaning apparatus (1)    Polymeric supply unit (3)    Physical cleaning unit (4)    Supernatent-liquor supply unit (5)    Chamber (8)    Substrate (9)    Cleaning-liquid supply nozzle (41)    Nozzle moving mechanism (48)