TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: Metal is chosen from nickel, iron, chromium, cobalt, aluminum, antimony, molybdenum, copper, silver, platinum, and gold.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The polymerization initiator includes azo polymerization initiator, peroxide polymerization initiator, redox polymerization initiator, benzoin ether photopolymerization initiator, acetophenone photopolymerization initiator, alpha -ketol photopolymerization initiator, aromatic sulfonyl chloride photopolymerization initiator, photoactive oxime photopolymerization initiator, benzoin photopolymerization initiator, benzyl photopolymerization initiator, benzophenone photopolymerization initiator, ketal photopolymerization initiator, thioxanthone photopolymerization initiator and/or acylphosphine oxide photopolymerization initiator. Monomer (a) is chosen from methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, hexyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate and isodecyl (meth)acrylate.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The electroconductive particles are roughly spherical electroconductive particles including large electroconductive particles (4a) comprising particles with a particle size of 15-50 mu m and small electroconductive particles (4b) comprising particles with a particle size of 1-12 mu m. The ratio of content of large electroconductive particles to content of small electroconductive particles in the pressure-sensitive adhesive layer is 1.1-8. Resin component includes acrylic polymer, or polymerized product of solventless-type pressure-sensitive adhesive composition. The content of acrylic polymer contained with respect to total content of pressure-sensitive adhesive is 20-60 %mass. Acrylic polymer contains 50 %mass or more monomer component (a). The electroconductive particles are glass or polymer particles coated with metal on its surface. The pressure-sensitive adhesive further contains a polymer containing polyfunctional monomer as monomer component (b). Polyfunctional monomer (b) includes hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl(meth)acrylate, vinyl(meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate and/or urethane acrylate. Preferred Properties: The pressure-sensitive adhesive layer has a thickness of 15-100 mu m, an electric resistance value of less than 6 Omega in thickness direction with an adhesive area of 5 mmx 5 mm, and a pressure-sensitive adhesive force of 3 N/20 mm or more to an adherend made of SUS plate.