TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The composition comprises about 60 wt.% to about 95 wt.% of the conductive powder; about 0.5 wt.% to about 20 wt.% of the glass frit; about 1 wt.% to about 30 wt.% of the organic vehicle; and about 0.5 wt.% to about 30 wt.% of the thermosetting resin. It further comprises about 0.1 wt.% to about 1 wt.% of a curing agent; and about 0.1 wt.% to about 5 wt.% of a reducing agent. Preferred Components: The thermosetting resin includes one or more of a bisphenol A epoxy resin, a tetra-functional epoxy resin, a tri-functional epoxy resin, an isocyanate resin, or a bismaleimide resin. The curing agent includes one or more of m-phenylene diamine (MPDA), diamino diphenyl methane (DDM), diamino diphenyl sulfone (DDS), methyl nadic anhydride (MNA), dodecenyl succinic anhydride (DDSA), maleic anhydride (MA), succinic anhydride (SA), methyltetrahydrophthalic anhydride (MTHPA), hexahydrophthalic anhydride (HHPA), tetrahydrophthalic anhydride (THPA), or pyromellitic dianhydride (PMDA). The reducing agent includes one or more of glutaric acid, malic acid, azelaic acid, abietic acid, adipic acid, ascorbic acid, acrylic acid, or citric acid. The glass frit includes one or more of zinc oxide-silicon oxide (ZnO-SiO2) glass fit, zinc oxide-boron oxide-silicon oxide (ZnO-B2O3-SiO2) glass frit, zinc oxide-boron oxide-silicon oxide-aluminum oxide (ZnO-B2O3-SiO2-Al2O3) glass frit, bismuth oxide (Bi2O3) glass frit, bismuth oxide-silicon oxide (Bi2O3-SiO2) glass frit, bismuth oxide-boron oxide-silicon oxide (Bi2O3-B2O3-SiO2) glass frit, bismuth oxide-boron oxide-silicon oxide-aluminum oxide (Bi2O3-B2O3-SiO2-Al2O3) glass frit, bismuth oxide-zinc oxide-boron oxide-silicon oxide (Bi2O3-ZnO-B2O3-SiO2) glass frit, bismuth oxide-zinc oxide-boron oxide-silicon oxide-aluminum oxide (Bi2O3-ZnO-B2O3-SiO2-Al2O3) glass frit, lead oxide (PbO) glass frit, lead oxide-tellurium oxide (PbO-TeO2) glass frit, lead oxide-tellurium oxide-silicon oxide (PbO-TeO2-SiO2) glass frit, lead oxide-tellurium oxide-lithium oxide (PbO-TeO2-Li2O) glass frit, bismuth oxide-tellurium oxide (Bi2O3-TeO2) glass frit, bismuth oxide-tellurium oxide-silicon oxide (Bi2O3-TeO2-SiO2) glass frit, bismuth oxide-tellurium oxide-lithium oxide (Bi2O3-TeO2-Li2O) glass frit, tellurium oxide (TeO2) glass frit, or tellurium oxide-zinc oxide (TeO2-ZnO) glass frit. The composition also comprises one or more of a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an anti-foaming agent, a pigment, a UV stabilizer, an antioxidant, or a coupling agent. Preferred Parameters: The conductive powder is a silver powder having an average particle diameter (D50) of about 0.1 mu m to about 10 mu m. The glass frit has D50 of about 0.1 mu m to about 10 mu m.