TECHNOLOGY FOCUS - CERAMICS AND GLASS - Preferred Composition: The glass frit comprises 30-99.9%, preferably 50-99.9%, more preferably 70-90% bismuth oxide, 0.01-15%, preferably 1-10% aluminum oxide, 0.01-15%, preferably 1-10% silicon dioxide, 0.01-10%, preferably 0.01-5% boron oxide, and 0.01-20%, preferably 5-15% lithium oxide and/or lithium phosphate. The content of glass frit is 0.01-10 wt.%, preferably 0.01-7 wt.%, more preferably 0.01-5 wt.% with respect to the electroconductive paste composition. Preferred Property: The glass frit has median particle diameter (d50) of 0.1-10 mu m, preferably 0.1-5 mu m, more preferably 0.1-1 mu m.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The electroconductive paste composition further comprises 0.01-1 wt.% aluminum, copper, aluminum-silicon compound, aluminum-phosphorus compound and/or copper compound, and 0.01-5 wt.%, preferably 0.05-1 wt.% adhesion enhancer. The content of metallic particles is 30-75 wt.%, preferably 30-50 wt.% with respect to total content of the electroconductive paste composition. The metallic particles comprise silver, aluminum, gold, nickel and/or their alloy, preferably silver and aluminum. The adhesion enhancer comprises tellurium, tungsten, molybdenum, vanadium, nickel, antimony, magnesium, zirconium, silver, cobalt, cerium, zinc or their oxide, preferably tellurium dioxide. Preferred Properties: The metallic particles have median particle diameter (d50) of 0.1-4 mu m, preferably 0.1-3 mu m, more preferably 0.1-1 mu m, and specific surface area of 1-3 m2/g, preferably 2-3 m2/g.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The organic solvent is carbitol, terpineol, hexyl carbitol, Texanol (RTM: ester alcohol), butyl carbitol, butyl carbitol acetate, dimethyl adipate and/or glycol ether.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The content of organic component is 20-60 wt.%, preferably 30-50 wt.%, more preferably 40-50 wt.% with respect to the electroconductive paste composition. The organic component comprises a binder, a surfactant, an organic solvent and an additional compound (A). The compound (A) is surfactant, thixotropic agent, viscosity regulator, stabilizing agent, inorganic additive, thickener, emulsifier, dispersant and/or pH regulator. The binder is poly-sugar, cellulose ester resin, phenolic resin, acrylic, polyvinyl butyral, polyester resin, polycarbonate, polyethylene, polyurethane resin and/or rosin derivative. The surfactant is polyethylene oxide, polyethylene glycol, benzotriazole, poly(ethylene glycol)acetic acid, lauric acid, oleic acid, capric acid, myristic acid, linoleic acid, stearic acid, palmitic acid, stearate salt and/or palmitate salt.