NOVELTY - A heat-conductive pressure-sensitive adhesive composition comprises 100 parts mass (meth)acrylic resin composition comprising 5-25 %mass (meth)acrylate polymer, 25-94.5 %mass (meth)acrylate monomer and 0.5-50 %mass monomer having organic acid group and mixed composition comprising 50-1000 parts mass heat-conductive filler (a) which is not surface-treated with silane coupling agent and 30-700 parts mass heat-conductive filler (b) which is surface-treated with silane coupling agent. The total content of heat-conductive filler (a) and heat-conductive filler (b) is 250-1300 parts mass.    USE - Heat-conductive pressure-sensitive adhesive composition is used for manufacturing sheet-like molded product for electronic device (all claimed). Uses include but are not limited to refrigerator, motor vehicle, personal computer, television, mobile telephone, rice cooker, washing machine, game machine, solar cell, electrophotographic copier etc.    ADVANTAGE - The heat-conductive pressure-sensitive adhesive sheet-like molded product formed using the heat-conductive pressure-sensitive adhesive composition has high tensile strength and thermal conductivity, and is prepared with high productivity.    DETAILED DESCRIPTION - A heat-conductive pressure-sensitive adhesive composition comprises 100 parts mass (meth)acrylic resin composition comprising 5-25 %mass (meth)acrylate polymer, 25-94.5 %mass (meth)acrylate monomer and 0.5-50 %mass monomer having organic acid group and mixed composition comprising 50-1000 parts mass heat-conductive filler (a) which is not surface-treated with silane coupling agent and 30-700 parts mass heat-conductive filler (b) which is surface-treated with silane coupling agent. The total content of heat-conductive filler (a) and heat-conductive filler (b) is 250-1300 parts mass. The heat-conductive pressure-sensitive adhesive composition is obtained by polymerizing (meth)acrylate monomer and monomer having organic acid group. INDEPENDENT CLAIMS are included for the following:    (1) heat-conductive pressure-sensitive adhesive sheet-like molded product;    (2) manufacture of heat-conductive pressure-sensitive adhesive composition;    (3) manufacture of heat-conductive pressure-sensitive adhesive sheet-like molded product; and    (4) electronic device.