TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The curing agent (D) contains nano inorganic particles.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The low-molecular amine compound (B) contains low-molecular amine compound (b1) of formulae (I)-(V), and low-molecular amine compound (b2) having structure different from the low molecular amine compound (b1). The low-molecular amine compound (b2) is chosen from compounds of formulae (VI)-(IX). The content of curing agent (D) is 1-60 %mass with respect to the amount of low-molecular amine compound.X1=N, C or methine;R1-R5=H, amino, monomethylamino, dimethylamino, hydroxy or 2-3C alkyl;R6-R9=H, amino, monomethylamino, dimethylamino, hydroxy or 1-3C alkyl;one or more of X2,Y1,Z1=N, and others are N or C;R10-R15=H, amino, hydroxy or 1-3C alkyl;one or more of X3,Y2=N, and others are N or C;R16-R20=H, amino, hydroxy or 1-3C alkyl;one or more of W1,X4,Y3,Z2=N, and other are C, N or methine;R21-R24=H, amino or 1-3C alkyl;X5,Y4=N or methine;R25-R26=H, amino or hydroxy;X6,Y5,Z3=N or methine;m=2-3;R27=H, amino or 1-3C alkyl;R28-R30=H or 1-3C alkyl;andR31-R35=H, amino, hydroxy or 1-3C alkyl.Preferred Process: The amine adduct (A) is obtained by reacting amine compound (a) with compound chosen from carboxylic compound, sulfonic acid compound, urea compound, isocyanate compound, and epoxy resin (e1). Preferred Property: The molecular weight distribution of amine adduct (A) is 1-7.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The thermosetting resin composition comprises curing agent (D) for epoxy resins, amine adduct (A), low-molecular amine compound (B) as core, and microcapsule-type latent hardener for epoxy resin as shell film which covers the core. The phenol resin (P) contains phenol resin of formula (X). The molar ratio of hydroxyl groups of all the epoxy groups/phenol resin (P) in the thermosetting resin composition is 0.5-3.R36=1-3C alkylene;R37-R41=H, 1-5C alkyl or alkenyl;n=0-5;andR37-R41=benzyl.