TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The diamine compound is: N-butyl-N'-isopropyl ethylenediamine, 1,2-bis(2-hydroxyphenyl)ethylenediamine, N,N'-bis(2-hydroxyethyl)ethylenediamine, N,N,N',N'-tetrakis(2-hydroxyethyl)ethylenediamine, N-(2-hydroxyethyl)ethylenediamine or N,N,N',N'-tetrakis(2-hydroxypropyl)ethylenediamine; and present in an amount of 0.001-1 wt.%. The alkali compound is potassium hydroxide, sodium hydroxide, ammonium hydroxide, tetra(hydroxymethyl)ammonium or tetra(hydroxyethyl) ammonium chloride. The composition further comprises: polysaccharide derived from a glucan compound, a fructan compound, a mannan compound, a galactan compound or their salts; a membranous polymer comprising 4-10C ring monomer substituted with nitrogen; a monomer having a ring structure comprising oxygen and sulfur atoms; and a cyclic compound. The glucan compound is cellulose, dimethylaminoethyl cellulose, diethylaminoethyl cellulose, ethyl hydroxyethyl cellulose, methyl hydroxyethyl cellulose, 4-amino-benzyl cellulose, triethyl amino ethyl cellulose, cyano ethyl cellulose, ethyl cellulose, methyl cellulose, carboxymethyl cellulose, carboxymethyl ethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, alginic acid, amylose, amylopectin, pectin, starch, dextrin, alpha-cyclodextrin, beta-cyclodextrin, gamma-cyclodextrin, hydroxypropyl-beta-cyclodextrin, methyl-beta-cyclodextrin, dextran, dextran sulfate sodium salt, saponin or glycogen. The monomer having the ring structure comprises N-vinylpyrrolidone, N-acryloylmorpholine, N-vinyl succinimide, N-acryloxysuccinimide, N-vinylcaprolactam and N-vinylcarbazole. The membranous polymer has a weight-average molecular weight of 1000-1000000. The membranous polymer and the cyclic compound have a boiling point of greater than or equal to 100 degrees C and Hansen solubility parameter of 6-15. The membranous polymer is 1x 10-12 wt.% compared to the texture-etchant composition. Preferred Method: The texture etching step is accomplished using the composition at a temperature of 50-100 degrees C for 30 seconds to 60 minutes. The method further comprises precipitating the crystalline silicon wafer in the composition at a temperature of 50-100 degrees C for 30 seconds to 60 minutes. EXAMPLE - No suitable example given.