NOVELTY - The package has microelectronic devices (102A-102F) positioned on a substrate (204). An encapsulation layer (302) encapsulates the microelectronic device and the substrate. A protective layer (402) is positioned around the encapsulating layer. A reinforcing layer (902) is coupled to the protective layer, where the substrate, encapsulation layer, protective layer and reinforcing layer form the package around the microelectronic device. The protective layer comprises a moisture resistant material that protects the microelectronic device from moisture.    USE - Flexible microsystems enabled microelectronic device package for packaging microelectronic device i.e. photovoltaic solar cell claimed, for application e.g. residential application, commercial application and utility scale solar power installation application.    ADVANTAGE - The package encapsulates the electronic devices and provides mechanical robustness, moisture resistance and a high degree of flexibility to the assembly of electronic devices in an efficient manner. The package allows material for adhesive layer to be flexible and elastomeric such that flexibility of the packaging is improved.    DETAILED DESCRIPTION - The reinforcing layer comprises Vectran (RTM: manufactured fiber), twaron (RTM: man-made fiber), Kevlar (RTM: para-aramid synthetic fiber) Marlan (RTM: retardant fabric) and Nomex (RTM: flame-resistant meta-aramid), aramid and carbon fiber. The encapsulation layer is an optically transparent encapsulating layer. The microelectronic device is a first photovoltaic solar cell. INDEPENDENT CLAIMS are also included for the following:    (1) a method for forming a flexible microsystems enabled microelectronic device package    (2) a system for forming a flexible microsystems enabled microelectronic device package.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional side view of flexible reinforcing layer connected to adhesive layer.    Microelectronic devices (102A-102F)    Adhesive layers (202, 602, 802)    Substrate (204)    Encapsulation layer (302)    Protective layer (402, 702)    Reinforcing layer (902)