TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: Metalloid substrate is composed of germanium. The II-VI compound is composed of zinc and selenium, preferably cadmium and tellurium. Metalloid is germanium. Single crystal compound composed of zinc and selenium, preferably cadmium, mercury, and tellurium which are grown on metalloid. Preferred Processes: Online process is performed by using copper substrate, metalloid substrate, and II-VI compound structure which are interwebbed, performing in inert gas atmosphere, using materials which consists of stainless steel and graphite aside from materials used to form single crystals and inert gas and materials used in masking and etching, and passing through material cleaning and control gate, copper ribbon productions chamber, 2nd control gate through which the copper ribbon passes, germanium deposition chamber, 3rd control gate through which copper ribbon with germanium film passes, etching and support mounting chamber, in which the bottom of the copper ribbon is masked, and most of the copper ribbon is chemically removed and replaced with material selected from the group comprising ceramics and hard plastics, leaving copper contacts that interface directly with the germanium film, 4th control gate through which germanium film with copper contacts passes, compound deposition chamber, and unloading and testing chamber, where the II-VI compound film and the germanium film with copper contacts come to air and exit for further handling in which copper ribbon productions chamber has pressure reduced to less than or equal to 10 mbar and is flooded with nitrogen and hydrogen, a copper ribbon is extruded directly from molten copper through isotropic graphite jet having optically flat inside surfaces, germanium deposition chamber is filled with argon and where evaporated germanium falls as deposited film into copper ribbon, etching and support mounting chamber has masked bottom of copper ribbon and where most of copper ribbon is chemically removed and replaced with material which consists of ceramics and hard plastics leaving copper contacts that interface directly with germanium film, compound deposition chamber is filled with argon and where evaporated II-VI compound falls as deposited film into germanium film, and unloading and testing chamber is where II-VI compound film and germanium film with copper contacts come to air and exit for further handling. Online process includes chemically removing majority of copper substrate to leave copper contacts that are interwebbed with crystal structure of metalloid and replacing portion of copper substrate that has been removed with material which consists of ceramics and hard plastics.