NOVELTY - The insulation layer (43) has a compliant insulation layer body comprising flexible O-shaped rings. Protruding feature is applied to a semiconductor switch module package to compress the compliant insulation layer body. The compliant insulation layer body is provided with a separate sheet (47) that is made of insulating material. The compliant insulation layer body is made of flexible adhesive material. An existing module is modified to accommodate the flexible insulation layer body. A custom module is designed to take reduced terminal spacing.    USE - Compliant insulation layer for being applied to a laminated bus structure and interfaced through bus connections with a semiconductor switch module such as half-bridge, transistor, silicon controlled rectifier or diode, for eliminating failure paths through air or across a surface in air between input terminals in electric vehicles and solar power applications.    ADVANTAGE - The insulation layer can be applied to a laminated bus structure and interfaced through bus connections with the semiconductor switch module e.g. half-bridge, for eliminating failure paths through air or across a surface in air between input terminals so as to allow reduced terminal spacing to reduce package size and minimize equivalent series inductance while satisfying or exceeding third party regulatory agency requirements for electrical clearance when installed, thus reducing inductance and improving safe operation at higher DC voltages without voltage overshoot causing switch failure at switch turn off. The semiconductor switch module comprises positive and negative electrical input connections which can be spaced adequately to prevent a short circuit flashover between polarities. The insulation layer improves power density of a converter by allowing safe operation at higher voltage so as to reduce installation cost, weight and size for power conversion systems.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a conformal insulation layer for being applied to a laminar bus and compressed between a bus structure and a semiconductor switch module to eliminate failure paths through air or over a surface in air such that spacing is reduced.    Positive bus plate (41)    Negative bus plate (42)    Compliant insulation layer (43)    Separate sheet (47)    Conducting bushings (411, 412)