NOVELTY - The method involves performing a deposition process to deposit a material layer on a first batch of semiconductor substrates (140) within a processing chamber (102). A first chamber seasoning process is performed to deposit a conductive seasoning layer over a surface of a chamber component placed in the chamber without a substrate being present after the substrate of the first batch of the substrates is deposited with the material layer. The deposition process is performed to deposit the material layer on a second batch of the substrates within the chamber after a second seasoning process.    USE - Method for processing a semiconductor substrate i.e. large area substrate, in a processing chamber i.e. plasma enhanced chemical vapor deposition chamber. Uses include but are not limited to LCDs, flat panel displays, organic LEDs and photovoltaic cells for solar cell arrays.    ADVANTAGE - The method enables covering a portion of a conductive body with an electrically insulative coating to improve deposition uniformity without expensive aging or plasma treatment of a support assembly. The method enables bellows to provide a vacuum seal between process volume and atmosphere outside the chamber, while facilitating movement of the support assembly. The method enables a shadow frame to prevent deposition at an edge of the substrate and the support assembly, so that the substrate does not stick to the support assembly. The method enables introducing oxygen-containing gas into the chamber along with cleaning gas, thus rapidly heating the chamber to improve effectiveness of a process.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for processing a substrate in a processing chamber.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a plasma enhanced chemical vapor deposition chamber including a substrate support.    Plasma enhanced chemical vapor deposition system (100)    Processing chamber (102)    Gas source (104)    Chamber walls of processing chamber (106)    Semiconductor substrates (140)