TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Device: The soldering pad is formed on the backside of the solar cell. It may be removed from the silicon wafer with a pull force of greater than or equal to 1 Newton, greater than or equal to 2 Newtons, greater than or equal to 3 Newtons, or greater than or equal to 5 Newtons. An electrode is formed on the front side of the silicon wafer. The front side of the silicon wafer further comprises an antireflective layer; or the silicon wafer has an antireflective coating on the front side. Preferred Composition: The soldering pad is formed from an electroconductive paste comprising about 30-75 wt.% of metallic particles; the soldering pad is formed from an electroconductive paste comprising about 30-60 wt.% of metallic particles; or the soldering pad is formed from an electroconductive paste comprising about 30-50 wt.% of metallic particles. Preferred Process: Producing solar cell further involves applying an aluminum-comprising paste to the backside of the silicon wafer overlapping the edges of the applied electroconductive paste composition; and applying a silver-comprising paste to the front side of the silicon wafer.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The glass frit comprises about 30-99.9%, preferably about 50-99.9%, more preferably about 70-90% Bi2O3; about 0.01-15%, more preferably about 1-10% Al2O3; about 0.01-15%, more preferably about 1-10% SiO2; about 0.01-10%, more preferably about 0.01-5% B2O3; and about 0.01-20%, more preferably about 5-15% Li2O or Li3PO4. The glass frit is about 0.01-10 wt.% of paste, preferably about 0.01-7 wt.%, more preferably about 0.01-6 wt.%, and most preferably about 0.01-5 wt.%. Metallic particles are about 30-75 wt.%, preferably about 30-60 wt.%, based upon 100% total weight of the electroconductive paste composition; or metallic particles are about 30-50 wt% of the electroconductive paste composition. The electroconductive paste composition further comprises about 0.01-1 wt.% of aluminum, copper, an aluminum-silicon compound, an aluminum-phosphorus compound, or a copper compound. Adhesion enhancer is about 0.01-5 wt.%, preferably about 0.05-2.5 wt.%, most preferably about 0.05-1 wt.%, of the electroconductive paste composition. Preferred Parameters: The glass frit has a median particle diameter (d50) of about 0.1-10 mu m, preferably about 0.1-5 mu m, more preferably about 0.1-2 mu m, most preferably about 0.1-1 mu m. The metallic particles have d50 of about 0.1-4 mu m, preferably about 0.1-3 mu m, preferably about 0.1-2 mu m, and most preferably about 0.1-1 mu m. The metallic particles have a specific surface area of about 1-3 m2/g, preferably about 2-3 m2/g. Preferred Components: The metallic particles comprise silver (preferred), aluminum, gold and nickel, or alloys or its mixtures; or the metallic particles preferably comprise silver and aluminum. The electroconductive paste composition further comprises an adhesion enhancer comprising a metal or a metal oxide, where the adhesion enhancer comprises metal selected from tellurium, tungsten, molybdenum, vanadium, nickel, antimony, magnesium, zirconium, silver, cobalt, cerium, and zinc, or its oxides. The adhesion enhancer is tellurium or tellurium dioxide. Adhesion enhancer is dispersed within the glass frit; or adhesion enhancer is dispersed within the electroconductive paste composition independent from the glass frit.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: Organic vehicle is about 20-60 wt.%, preferably about 30-50 wt.%, most preferably about 40-50 wt.% of electroconductive paste composition. Preferred Components: The organic vehicle comprises a binder, a surfactant, an organic solvent and an additional compound selected from surfactants, thixotropic agents, viscosity regulators, stabilizing agents, inorganic additives, thickeners, emulsifiers, dispersants, pH regulators, and its combinations. The binder is poly-sugar, cellulose ester resin, phenolic resin, acrylic, polyvinyl butyral or polyester resin, polycarbonate, polyethylene or polyurethane resins, or rosin derivatives. The surfactant is polyethylene oxide, polyethylene glycol, benzotriazole, poly(ethyleneglycol)acetic acid, lauric acid, oleic acid, capric acid, myristic acid, linoleic acid, stearic acid, palmitic acid, stearate salts, palmitate salts, and its mixtures. The organic solvent is carbitol, terpineol, hexyl carbitol, texanol, butyl carbitol, butyl carbitol acetate, dimethyladipate or glycol ether. EXAMPLE - No suitable example given.