NOVELTY - A heat conductive pressure-sensitive adhesive composition is obtained by polymerizing (meth)acrylate monomer in a mixed composition which comprises 100 parts mass (meth)acrylic resin composition comprising a (meth)acrylate polymer and (meth)acrylate monomer, 250-1300 parts mass heat conductive filler, and 0.05-6 parts mass silane coupling agent.    USE - Heat conductive pressure-sensitive adhesive composition is used for manufacturing heat conductive pressure sensitive adhesive sheet-like molded product used in electronic device (all claimed). Uses include but are not limited to personal computer, TV, mobile telephone, automatic vending machine, refrigerator, solar cell, surface-conduction electron-emitter display, organic electroluminescent display, inorganic electroluminescent display, notebook personal computer, etc.    ADVANTAGE - The heat conductive pressure-sensitive adhesive composition has excellent tensile strength, flexibility and external appearance while having an increased amount of an additive which improves thermal conductivity.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) manufacture of heat conductive pressure sensitive adhesive composition, which involves producing mixed composition, and polymerizing (meth)acrylate monomer;    (2) manufacture of heat conductive pressure sensitive adhesive sheet-like molded product (4, 14, 24), which involves polymerizing (meth)acrylate monomer in the mixed composition and molding into sheet form; and    (3) electronic device, which comprises a heat generating component (2, 12a, 12b, 22), and the heat conductive pressure sensitive adhesive sheet-like molded product or the heat conductive pressure sensitive adhesive bonded to the heat generating component.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view explaining usage of heat conductive pressure sensitive adhesive composition and heat conductive pressure sensitive adhesive sheet-like molded product.    Substrate (1)    Heat generating component (2,12a,12b,22)    Thermal radiation component (3,13)    Heat conductive pressure sensitive adhesive sheet-like molded product (4,14,24)