NOVELTY - A thermoconductive pressure-sensitive adhesive composition (F) is produced by conducting a polymerization reaction of (meth)acrylic ester monomer (( alpha )1) in a mixed composition comprising 100 parts mass (meth)acrylic resin composition (A) which includes (meth)acrylic ester polymer (A1) and the (meth)acrylic ester monomer (( alpha )1), 6-45 parts mass expanded graphite powder (B), 150-450 parts mass flame resistant thermoconductive inorganic compound (D), and 300-700 parts mass thermoconductive filler (C) having an average particle size of 50 mu m or more.    USE - Thermoconductive pressure-sensitive adhesive composition is used for forming thermoconductive pressure-sensitive-adhesive sheet-like molded component for electronic device (all claimed). Uses include but are not limited to personal computer, television, mobile telephone, automatic vending machine, refrigerator, solar cell, surface-conduction electron-emitter display, organic electroluminescent illumination, notebook personal computer, fuel cell, semiconductor device, etc.    ADVANTAGE - The thermoconductive pressure-sensitive adhesive composition provides thermoconductive pressure-sensitive-adhesive sheet-like molded component having excellent flame retardance, and electronic device having excellent thermal conductivity.    DETAILED DESCRIPTION - A thermoconductive pressure-sensitive adhesive composition (F) is produced by conducting a polymerization reaction of (meth)acrylic ester monomer (( alpha )1) in a mixed composition comprising 100 parts mass (meth)acrylic resin composition (A) which includes (meth)acrylic ester polymer (A1) and the (meth)acrylic ester monomer (( alpha )1), 6-45 parts mass expanded graphite powder (B) having an average particle size of 50 mu m or more, 150-450 parts mass flame resistant thermoconductive inorganic compound (D) other than the expanded graphite powder (B), and 300-700 parts mass thermoconductive filler (C) having an average particle size of 50 mu m or more and a BET specific surface area of 0.4 m2/g or less, other than the expanded graphite powder (B) and the flame resistant thermoconductive inorganic compound (D). INDEPENDENT CLAIMS are included for the following:    (1) Thermoconductive pressure-sensitive-adhesive sheet-like molded component (4,14,24) (G);    (2) manufacture of thermoconductive pressure-sensitive adhesive composition (F);    (3) manufacture of thermoconductive pressure-sensitive-adhesive sheet-like molded component (G); and    (4) electronic device.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of thermoconductive pressure-sensitive-adhesive sheet-like molded component. (Drawing includes non-English language text)    Substrate (1)    Heat generating component (2,12a,12b,22)    Thermal radiation component (3,13)    Thermoconductive pressure-sensitive-adhesive sheet-like molded component (4,14,24)