TECHNOLOGY FOCUS - ELECTRONICS - Preferred Components: Electronic device contacts the conductive particles on the surface of the adhesive layer. Electronic device is integrated circuit, printed circuit, LED, or display device.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Compositions: Conductive particle includes a layer of metal, intermetallic compound, or interpenetrating metal compound.    TECHNOLOGY FOCUS - POLYMERS - Preferred Compositions: Block copolymer has a hard and a soft block or segment. Insulation layer contains blend of block copolymer and thermoplastic polymer (TPP) which is incompatible with the ACF adhesive resin. TPP is the same as or compatible with one of the blocks or segments of the block copolymer. Block copolymer includes a block or segment selected from styrenic, olefinic, polyamide, polyurethane, polyester, polyacrylate, or polymethacrylate blocks. Block copolymer contains greater than or equal to 10 wt.% styrenic block. At least a portion of the conductive particles are partially embedded in the adhesive layer. Block copolymer is present on the surface of the conductive particle in an amount of 5-100%, preferably 20-100% surface coverage. Block copolymer is styrenic or acrylic block copolymer. Block copolymer is poly(styrene-b-butadiene-b-styrene), poly(styrene-b-isoprene-b-styrene), poly(styrene-b-butadiene-b-methyl methacrylate), and/or poly(methyl methacrylate-b-butyl acrylate-b-methyl methacrylate). Insulation layer is a blend of block copolymer with TPP e.g. polystyrene, poly( alpha -methylstyrene), poly(methacrylate), poly(acrylate), and/or their copolymers. Adhesive includes epoxy resin, phenoxy resin, acrylic resin, or cyanate ester resin. Adhesive includes multifunctional epoxide, multifunctional acrylate, multifunctional methacrylate, or multifunctional cyanate ester. Block or segment is incompatible with bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, and/or their polymers or copolymers. Block copolymer includes block or segment that is incompatible with multifunctional acrylates or multifunctional methacrylates. Block copolymer is ABA, AB, (AB)n, or ABC types of block copolymer, where n is not defined. Block copolymer contains polystyrene or poly- alpha -methylstyrene block; polybutadiene or polyisoprene block; polyurethane or polyester block; polyurethane or polyester block; or polyester, polyether, or polysiloxane block. Block copolymer contains poly(alkyl methacrylate) block or poly(alkyl acrylate) block in which alkyl group has carbon number of 1-30. Preferred Parameters: Soft block or segment has glass transition temperature (Tg) or melting point (Tm) of less than or equal to 25 degrees C. Hard block or segment has Tg or Tm of greater than or equal to 50 degrees C. Incompatible block or segment of the block copolymer has a difference in solubility parameter of greater than or equal to 1.2 (Cal/cc)1/2 as compared to that of the ACF adhesive resin. TPP has a difference in solubility parameter of greater than or equal to 1.2 (Cal/cc)1/2 as compared to that of the ACF resin. The particles are arranged in an array having a pitch of 3-30 mu m, preferably 5-12 mu m in the X and/or Y direction. A substantial proportion of the particle sites have less than or equal to 1 conductive particle at each particle site. Less than three quarters , preferably one half -2/3 of the particle diameter is embedded in the adhesive layer. Adhesive layer has thickness of 5-35 mu m, preferably 10-25 mu m.