NOVELTY - The structure (1000) has a cover plate (100) arranged with dimension of about 165 cm and greater in direction including a front surface and a rear surface opposed to the front surface. Two solar devices (301, 303) are laminated side by side to the rear surface and coupled to each other by a ribbon connector (402), where each of the devices comprises a set of thin-film photovoltaic cells overlying a substrate (311), and each of the cells comprises a stripe-shaped pattern in parallel to each other. The plate comprises an opaque region (105) over peripheral edge regions of the devices.    USE - Structure for tiling industrial thin-film solar devices on a transparent cover plate for electrical power applications.    ADVANTAGE - The structure enhances power capacity of a solar module by extending either circuit current delivered from an entire module or voltage level for coupling with outside electric contacts. The structure allows encapsulation of an integrated module to be compatible with a stand alone module, so that additional cost is reduced in packaging process. The structure scales up the stand alone thin-film solar device and integration provide high quality with reduced cost and enhanced overall efficiency. The structure ensures that photovoltaic layer edges of the solar device are easily subjected to heating by sun light irradiation different from area with a photovoltaic layer, which leads to thermal stress and eventually macroscopic cracking to the solar device if an opaque area is not used.    DETAILED DESCRIPTION - The cover plate is made of transparent polymer. The solar devices are attached to the rear surface through transparent polymer selected from a group consisting of ethylene vinyl acetate and polyvinyl butyral. The solar devices comprises a peripheral edge region sealed by polymeric sealant material selected from a group consisting of butyl rubber, urethane and polyurethane materials, polyisobutylene materials, epoxide materials, polysulfamide materials and cyanoacrylates. The stripe-shaped pattern is made of chalcopyrite compound semiconductor materials selected from a group consisting of copper indium diselenide, copper indium disulfide, copper indium gallium diselenide and copper indium disulfide.    DESCRIPTION OF DRAWING(S) - The drawing shows a exploded perspective view of a structure for tiling solar devices.    Cover plate (100)    Oopaque frame region (105)    Solar devices (301, 303)    Substrates (311, 313)    Ribbon connectors (402, 403)    Structure for tiling industrial thin-film solar devices (1000)