NOVELTY - A dielectric glass composition suitable for use in an electronic device, comprises: a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment; and one or more alkali metal oxides, where the total content of the alkali metal oxides is at least 10 wt.% and not more than 35 wt.%, based upon 100% total weight of the glass composition, where the median particle size (d50) of the glass composition is not more than about 5 mu m.    USE - A dielectric glass composition for use in an electronic device, where the device is selected from an electric circuit, a solar cell, and LED, a display, a capacitor, a resistor, and any combination (claimed).    ADVANTAGE - The dielectric glass composition is lead-free, exhibits exceptional heat dissipation, electrical performance and adhesion to the underlying substrate, while also maintaining durability at elevated humidity levels. Furthermore, the dielectric glass compositions allow for the efficient formation of hybrid thick film circuits by printing and firing various thick film materials, such as conductors, resistors, dielectrics, and the like in less manufacturing steps.    DETAILED DESCRIPTION - A dielectric glass composition suitable for use in an electronic device, comprises: a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment; and one or more alkali metal oxides, where the total content of the alkali metal oxides is at least 10 wt.% and not more than 35 wt.%, based upon 100% total weight of the glass composition, where the median particle size (d50) of the glass composition is not more than about 5 mu m, and the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and not more than about 25 ppm/K. INDEPENDENT CLAIMS are included for:    (1) a dielectric paste composition suitable for use in an electronic device, comprising: at least one dielectric glass composition; and an organic vehicle;    (2) a method which involves applying the dielectric paste composition to at least one surface of a substrate; and    (3) an electronic device prepared by the latter method; and/or comprising: a substrate having at least one surface; and a dielectric paste composition applied to at least a portion of the at least one surface, where the dielectric paste composition is subjected to one or more thermal treatment steps to form a dielectric layer.