The Surface Preparation and Cleaning Conference (SPCC)

Prazo para submissão: 01 September 2024

Data de Notificação: 01/04/2025

Editora: Elsevier

Revista: Microelectronic Engineering

Link: https://www.sciencedirect.com/special-issue/313855/the-surface-preparation-and-cleaning-conference-spcc

Detalhes:

This Special Issue addresses current and anticipated challenges facing the surface preparation and cleaning industry. The presentations target cutting-edge research cleaning technologies for the electronics industry. They will encompass front-end, back-end, packaging, equipment, materials and metrology developments and issues in wafer cleaning. Dr. David Maloney(semiconductor Processing,chemistry,materials science) Special issue information: