Special Issues Special Issues

Special issue for EuroSimE 2024

Prazo para submissão: 31 December 2024

Data de Notificação: 01/04/2025

Editora: Elsevier

Revista: Microelectronics Reliability

Link: https://www.sciencedirect.com/special-issue/313705/special-issue-for-eurosime-2024

Detalhes:

Dr. PrzemyslawGromalaRobert Bosch GmbH, Mobility Electronics, Germany(Microelectronics and packaging, Physics of Failure simulations, Material characterization and modeling, Reliability, Predictive Maintenance) Prof. AlbertoCoriglianoFull Professor, Politecnico di Milano, Dept. of Civil and Environmental Engineering, Politecnico di Milano, Italy(Solid and structural mechanics, computational mechanics, MEMS, reliability, metamaterials)

Special Issues