Prazo para submissão: 31 October 2024
Data de Notificação: 01/04/2025
Editora: Elsevier
Revista: Chip
Link: https://www.sciencedirect.com/special-issue/313222/2d-material-chips
Detalhes:
Tenured Associate Professor, He Tian, Tsinghua University, China https://www.sic.tsinghua.edu.cn/en/info/1080/1379.htm Professor Mingdong Dong, Aarhus University, Denmark https://inano.au.dk/research/senior-scientists/a-d/dong-mingdong/ Professor, Philip Feng, University of Florida, USA https://www.ece.ufl.edu/people/faculty/philip-feng/ Special issue information: