2D Material Chips
Prazo para submissão: 31 October 2024
Tenured Associate Professor, He Tian, Tsinghua University, China https://www.sic.tsinghua.edu.cn/en/info/1080/1379.htm Professor Mingdong Dong, Aarhus University, Denmark https://inano.au.dk/research/senior-scientists/a-d/dong-mingdong/ Professor, Philip Feng, University of Florida, USA https://www....